The Technical University of Munich (TUM) is expanding its research in the field of chip design. Under the leadership of TUM Professor Dr.-Ing. Hussam Amrouch, Chair of AI Processor Design and Head of the Munich Advanced-Technology Center for High-Tech AI Chips (MACHT-AI), TUM has signed a Memorandum of Understanding (MoU) with the Belgian research center imec.

The agreement was signed on the occasion of the official opening of imec’s new office in Heilbronn (Baden-Württemberg). The collaboration aims to establish joint activities in knowledge sharing, education, and hands-on development of advanced chip and packaging technologies. This new connection between Bavaria and Baden-Württemberg further strengthens Europe’s position in semiconductor research.

The imec Automotive Chiplet Program focuses on chiplet-based architectures for the automotive industry. Through this collaboration, TUM gains access to a Europe-wide network of leading industrial and research partners to jointly advance the development of modern chip architectures and system integration. The partnership seeks to build joint expertise in chip design, advanced packaging, and system integration, with a strong emphasis on knowledge exchange, training, and practical development.

The imec Automotive Chiplet Program (ACP) is part of a broader European initiative aimed at developing scalable, software-defined hardware platforms.